Requisition ID: 102793-0
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Responsible for all SMT process and yield improvement, engineering problem solving and productivity promotion. Make decisions and take actions to support production process quality and yield
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Drive process control, failure analysis and problem solving involving PCB assembly and soldering material.
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Responsible for new process and equipment technology improvement.
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Utilize Six Sigma methodology to identify critical parameter, analyze process gap and develop new process/ equipment technology to leap frog the current manufacturing capability.
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Handle process improvement for ultimate yield and quality, less scrap and cycle time. Support scrap and waste elimination initiative. Drive error-proof solutions involving fixture design and automation to reduce human dependency and streamline process flow
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Support new product introduction and transfer. Generate the build report .Utilize DFM tools to assess new product and ensure meeting manufacturing design guideline and best practices for flawless launch.
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Experience of reflow , solder wave is advantageous
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Experience of stencil design, pallet design, fixture design is advantageous
Qualifications & Requirements
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Bachelor’s degree preferably in Manufacturing/ Industrial/ Mechanical/ Material Engineering
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Experience in Surface Mount Technology will be an advantage.
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Knowledge in Material/ Metallurgy Failure Analysis (SEM, EDX etc) will be an advantage.
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Knowledge in Statistical and Lean Six Sigma Methodology will be an advantage.
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Knowledge in DFM with good understanding of PCB design guidelines will be an advantage.
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Good interpersonal skills and ability to work independently in a dynamic environment.